迪耐富士康签备忘录 投资数十亿美元马来西亚建造12寸晶圆厂
2022年5月22日

迪耐富士康签备忘录 投资数十亿美元马来西亚建造12寸晶圆厂

(吉隆坡18日讯)富士康(Foxconn)将投资数十亿美元,在大马建立一座芯片制造厂,料每月生产4万片晶片以满足电动汽车使用半导体的巨大需求。

中国财联社报导,该工厂制造的晶片,将包括28纳米和40纳米工艺,而这些是微控制器、传感器、驱动器集成电路和连接相关芯片(即包含Wifi和蓝牙)最广泛使用的芯片生产技术。

据了解,富士康是透过一家子公司,和大马科技公司即Dagang NeXchange有限公司签署谅解备忘录,以成立合资企业,在马建造和运作一所12英吋芯片工厂。

报导说,富士康掌握Dagang NeXchange有限公司约5%股份,并拥有1个董事会席位,意味富士康也间接控制Dagang NeXchange旗下子公司,即了芯片制造商SIlterra在马的8英吋芯片厂。

虽然有关当局还没公布大马这座新的芯片制造厂具体位置和投资规模等细节,但芯片业内人士估计,有关项目的资本支出或介于30亿美元至50亿美元(约132亿令吉至219亿令吉)之间。

KUALA LUMPUR (May 17): Dagang NeXchange Bhd (DNeX) has teamed up with a unit of Taiwanese giant Hon Hai Precision Industry Co Ltd (better known as Foxconn) to build and operate a wafer fabrication plant in Malaysia.

In a filing, DNeX said it has inked a memorandum of understanding (MoU) with Foxconn’s wholly-owned subsidiary, Big Innovation Holdings Ltd (BIH), to set up a joint venture company for that purpose.

The proposal is to build and operate a 12-inch wafer fabrication plant here, capable of producing up to 40,000 wafers per month in 28-nanometer and 40-nanometer technology.

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“The entry into the MoU forms a basis of commitment between the company and BIH to undertake the agreed role and responsibilities in creating a mutual understanding of the strategy and business needs between the parties,” DNeX said.

This will enable broader understanding for the benefits and opportunities of working with each other and create opportunities for future partnerships for the parties in relation to the proposed project, it added.

DNeX noted that the MoU is to be valid for a period of one year commencing from May 17, 2022, and may be further extended by mutual agreement by the parties.

The MoU came nearly a year after Foxconn emerged as a shareholder of DNeX, which itself expanded into the semiconductor space by taking over loss-making SilTerra Malaysia Sdn Bhd from Khazanah Nasional Bhd.

DNeX bought into SilTerra in mid-2021 through a 60:40 consortium with Beijing Integrated Circuit Advanced Manufacturing and High-End Equipment Equity Investment Fund Centre (CGP Fund). The entire SilTerra stake was sold by Khazanah for RM273 million.

Subsequently, Foxconn bought 120 million DNeX shares in June 2021, representing 5.03% stake for RM108 million or 90 sen per share. At the time, the move raised speculation that Foxconn was eyeing a direct stake in SilTerra.

That stake has since been diluted to 3.08% following a series of warrant conversions by July 2021 at 50 sen apiece, when DNeX’s share price shot up to the 70-90 sen range upon winning the SilTerra bid.

In December 2021, DNeX said it was in talks with CGP and its shareholder Foxconn regarding SilTerra’s expansion plan.

“Part of the discussions is for a big capacity upgrade at SilTerra, which Foxconn definitely wants to look into and invest in,” DNeX group managing director Tan Sri Syed Zainal Abidin Syed Mohamed Tahir told reporters at the time.

He added that the group has excess land in Kulim, Kedah, which could fit another wafer plant block, for which it has initiated discussions with Foxconn and CGP Fund.

In the cumulative six months ended Dec 31, 2021, DNeX’s technology industries division booked an operating profit of RM120.01 million on revenue of RM371.5 million, representing 56% and 59% of group operating profit and group revenue, respectively.

DNeX shares closed five sen or 5% higher at RM1.05, giving it a market capitalisation of RM3.31 billion. Year-to-date, the counter is up 29 sen or 38.16%.

来源:https://mp.weixin.qq.com/s/HNryk1J7Ub0Zxi4Meiov2Q